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What are the characteristics of fused silica powder and what field is it usually used in?
Edit:Lianyungang Oster Silicon Powder Co., Ltd.   PublicDate:2020-05-25

Fused silica powderWhat are the characteristics and what are they usually used in?

Fused silica powder is made of fused silica, glass and other materials as the main raw materials, and is produced by grinding, grading and impurity removal. It has high purity, high insulation, low linear expansion coefficient and internal stress. Low and excellent motor performance.

Fused silicon powder has high purity, low dielectric constant, dielectric loss and linear expansion coefficient. It is better than crystalline silicon powder in the signal transmission speed, transmission quality and reliability of electronic products. It can be used in smart phones, automobiles, and network communications. In the copper clad laminates used in industrial equipment; in the epoxy plastic packaging materials used in integrated circuit packaging such as air conditioners, washing machines, refrigerators, charging piles, and photovoltaic modules; and in the fields of adhesives, coatings, ceramics, and encapsulants.

The other spherical silicon powder is made of selected angular silicon powder as a raw material and processed into a spherical silicon dioxide powder material by flame melting. It has excellent characteristics such as small specific surface area, good mobility and low stress.

Compared to the angular silicon powder, the spherical silicon powder has good surface mobility, and the filling rate is higher than that of the angular silicon powder. It can significantly reduce the linear expansion coefficient of the copper clad laminate and epoxy plastic packaging compound, and improve the reliability of electronic products. At the same time, the spherical silicon powder can reduce the correlation The wear of equipment and molds during product manufacturing can be applied to copper clad laminates for aerospace, radar, computers, 5G communications, etc.; epoxy for large-scale integrated circuit packaging such as smart phones, digital cameras, flat panel displays, processors, and switches Plastic packaging materials; and coatings, special ceramics, fine chemicals and other fields.

The above is the characteristics and applicable fields of fused silica powder that the editor tells you. You can simply understand it. The content is for reference, you can contact us at any time if you want to know more inquiries.


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