Fused silica powderIt is a fine powder made of natural quartz, smelted at high temperature, cooled amorphous silica as the main raw material, and processed by a unique process. The product has high purity, low thermal expansion coefficient, low internal stress, high humidity resistance, low radioactivity and other excellent characteristics. And has the following characteristics: extremely low coefficient of linear expansion; good electromagnetic radiation; stable chemical characteristics such as chemical corrosion resistance; reasonable, orderly and controllable particle size distribution. Mainly used in electronic packaging, pcd ink, investment casting, insulation, paint coating, silicone rubber and other industries. Physical properties and technical indicators of fused silica powder:

Printed circuit boards in electronic and electrical products often use copper clad laminate (CCL) as the substrate, and the addition of ultra-fine Chuangguo silicon powder as a filler can improve the CTE, heat resistance and reliability of the copper clad laminate.

Ultrafine crystalline silicon powder and fused silicon powder are common fillers for copper clad laminates; fused silica powder can be used as a filler for Low Dk copper clad laminates;

Printed circuit board ink is a necessary protective material for circuit boards. Chuangguo ultrafine crystalline silicon powder can provide ideal scratch resistance, low thermal expansion coefficient, chemical resistance and long-term reliability for circuit boards.

Devices such as capacitors and resistors in electronic and electrical products are packaged with epoxy encapsulants. Chuangguo fused silica powder is a common component of epoxy encapsulant

Components such as power supplies in electronic and electrical products are often sealed with epoxy or silicone electronic potting glue. Chuangguo crystalline silicon powder, fused silicon powder, and silicon powder can be selected as potting fillers according to the thermal expansion coefficient, thermal conductivity, viscosity, cost and other considerations. Spherical alumina is used for the sealing of power devices because of its high filling and cost-effective thermal conductivity.

The miniaturization of electronic products makes thermal management very necessary. Thermal interface material (TIM) can fill the air gap caused by the uneven contact surface of electronic product components, thereby improving the heat dissipation capacity. Thermally conductive gaskets or thermally conductive silicone grease are common thermal interface materials, while Chuangguo crystalline silicon powder, alumina powder and other high thermally conductive fillers are important components of thermally conductive gaskets or thermally conductive silicone grease.

The above is a brief description of the physical properties and technical indicators of fused silica micropowder by the editor. You can simply understand it. The content is for reference only, and you can contact us if you need advice.